B. Wunderle

74 papers and 628 indexed citations i.

B. Wunderle has authored 74 papers that have received a total of 628 indexed citations. This includes 45 papers in Electrical and Electronic Engineering, 27 papers in Mechanics of Materials and 22 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (34 papers), Integrated Circuits and Semiconductor Failure Analysis (12 papers) and Force Microscopy Techniques and Applications (11 papers). B. Wunderle is often cited by papers focused on Electronic Packaging and Soldering Technologies (34 papers), Integrated Circuits and Semiconductor Failure Analysis (12 papers) and Force Microscopy Techniques and Applications (11 papers) and collaborates with scholars based in Germany, Russia and France. B. Wunderle's co-authors include B. Michel, O. Hölck, H. Reichl, Olaf Wittler and Dietrich R. T. Zahn and has published in prestigious journals such as Journal of Applied Physics, Acta Materialia and Journal of Materials Science