Barbara Horváth

23 papers and 338 indexed citations i.

Barbara Horváth has authored 23 papers that have received a total of 338 indexed citations. This includes 22 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 5 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (6 papers) and Copper Interconnects and Reliability (5 papers). Barbara Horváth is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (6 papers) and Copper Interconnects and Reliability (5 papers) and collaborates with scholars based in Japan, Hungary and Switzerland. Barbara Horváth's co-authors include Balázs Illés, Tadashi Shinohara, Gábor Harsányi, Olivér Krammer and Helmut Schift and has published in prestigious journals such as ACS Applied Materials & Interfaces, Journal of Materials Science and Corrosion Science