Olivér Krammer

51 papers and 468 indexed citations i.

Olivér Krammer has authored 51 papers that have received a total of 468 indexed citations. This includes 45 papers in Electrical and Electronic Engineering, 28 papers in Mechanical Engineering and 9 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (42 papers), 3D IC and TSV technologies (14 papers) and Injection Molding Process and Properties (8 papers). Olivér Krammer is often cited by papers focused on Electronic Packaging and Soldering Technologies (42 papers), 3D IC and TSV technologies (14 papers) and Injection Molding Process and Properties (8 papers) and collaborates with scholars based in Hungary, Czechia and Poland. Olivér Krammer's co-authors include Balázs Illés, Karel Dušek, David Bušek, Attila Géczy and László Jakab and has published in prestigious journals such as IEEE Transactions on Industrial Electronics, International Journal of Heat and Mass Transfer and Corrosion Science