Karel Dušek

58 papers and 340 indexed citations i.

Karel Dušek has authored 58 papers that have received a total of 340 indexed citations. This includes 47 papers in Electrical and Electronic Engineering, 34 papers in Mechanical Engineering and 7 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (44 papers), 3D IC and TSV technologies (16 papers) and Advanced Welding Techniques Analysis (9 papers). Karel Dušek is often cited by papers focused on Electronic Packaging and Soldering Technologies (44 papers), 3D IC and TSV technologies (16 papers) and Advanced Welding Techniques Analysis (9 papers) and collaborates with scholars based in Czechia, Hungary and Poland. Karel Dušek's co-authors include David Bušek, Balázs Illés, Olivér Krammer, Agata Skwarek and Attila Géczy and has published in prestigious journals such as Journal of Chromatography A, International Journal of Heat and Mass Transfer and Applied Surface Science