Bau‐Tong Dai

82 papers and 1.3k indexed citations i.

Bau‐Tong Dai has authored 82 papers that have received a total of 1.3k indexed citations. This includes 61 papers in Electrical and Electronic Engineering, 40 papers in Materials Chemistry and 29 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Copper Interconnects and Reliability (26 papers), Semiconductor materials and devices (24 papers) and Electrodeposition and Electroless Coatings (15 papers). Bau‐Tong Dai is often cited by papers focused on Copper Interconnects and Reliability (26 papers), Semiconductor materials and devices (24 papers) and Electrodeposition and Electroless Coatings (15 papers) and collaborates with scholars based in Taiwan, United States and Australia. Bau‐Tong Dai's co-authors include Jia‐Min Shieh, Ming‐Shiann Feng, Shih-Chieh Chang, Chien-Wei Liu and Fu-Liang Yang and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Applied Surface Science