Ming‐Shiann Feng

39 papers and 440 indexed citations i.

Ming‐Shiann Feng has authored 39 papers that have received a total of 440 indexed citations. This includes 33 papers in Electrical and Electronic Engineering, 20 papers in Electronic, Optical and Magnetic Materials and 16 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (19 papers), Semiconductor materials and devices (16 papers) and Electrodeposition and Electroless Coatings (14 papers). Ming‐Shiann Feng is often cited by papers focused on Copper Interconnects and Reliability (19 papers), Semiconductor materials and devices (16 papers) and Electrodeposition and Electroless Coatings (14 papers) and collaborates with scholars based in Taiwan, United States and Australia. Ming‐Shiann Feng's co-authors include Shih-Chieh Chang, Jia‐Min Shieh, Bau‐Tong Dai, Chia‐Fu Chen and Ying-Lang Wang and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society