Bob Chylak

23 papers and 201 indexed citations i.

Bob Chylak has authored 23 papers that have received a total of 201 indexed citations. This includes 22 papers in Electrical and Electronic Engineering, 8 papers in Mechanical Engineering and 4 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (19 papers) and Copper Interconnects and Reliability (4 papers). Bob Chylak is often cited by papers focused on Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (19 papers) and Copper Interconnects and Reliability (4 papers) and collaborates with scholars based in Singapore, United States and Germany. Bob Chylak's co-authors include Horst Clauberg, Zhong Chen, Ivy Qin, Viola L. Acoff and Chee Lip Gan and has published in prestigious journals such as Acta Materialia, Scripta Materialia and Microelectronics Reliability