Chee Lip Gan
About
Chee Lip Gan has authored 182 papers that have received a total of 5.0k indexed citations.
This includes 111 papers in Electrical and Electronic Engineering, 57 papers in Materials Chemistry and 57 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (57 papers), Copper Interconnects and Reliability (36 papers) and 3D IC and TSV technologies (35 papers). Chee Lip Gan is often cited by papers focused on Electronic Packaging and Soldering Technologies (57 papers), Copper Interconnects and Reliability (36 papers) and 3D IC and TSV technologies (35 papers) and collaborates with scholars based in Singapore, United States and China. Chee Lip Gan's co-authors include Zehui Du, Carl V. Thompson, Hua Zhang, K. L. Pey and Yizhong Huang and has published in prestigious journals such as Science, Angewandte Chemie International Edition and Advanced Materials
In The Last Decade
Explore authors with similar magnitude of impact
Top countries impacted by papers by L. Edwards Top fields papers by Katsuaki Tanaka are about Top countries impacted by papers by Simon Green Top journals papers by Kimberly E. Kurtis are published in Top authors papers by Fan Liu are co-authored with Top authors papers by Herbert S. Schwartz are co-authored with Top fields papers by Ingeborg Rossow are about Top fields papers by Ronald W. Hart are about