Carl V. Thompson
About
Carl V. Thompson has authored 365 papers that have received a total of 18.9k indexed citations.
This includes 227 papers in Electrical and Electronic Engineering, 149 papers in Electronic, Optical and Magnetic Materials and 139 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (121 papers), Semiconductor materials and devices (110 papers) and Electronic Packaging and Soldering Technologies (69 papers). Carl V. Thompson is often cited by papers focused on Copper Interconnects and Reliability (121 papers), Semiconductor materials and devices (110 papers) and Electronic Packaging and Soldering Technologies (69 papers) and collaborates with scholars based in United States, Singapore and Germany. Carl V. Thompson's co-authors include Henry I. Smith, Yang Shao‐Horn, H.J. Frost, Chee Lip Gan and L. A. Clevenger and has published in prestigious journals such as Nature, Science and Physical Review Letters
In The Last Decade
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