Bo‐In Noh

56 papers and 957 indexed citations i.

Bo‐In Noh has authored 56 papers that have received a total of 957 indexed citations. This includes 53 papers in Electrical and Electronic Engineering, 22 papers in Mechanical Engineering and 9 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (36 papers) and Advanced Welding Techniques Analysis (17 papers). Bo‐In Noh is often cited by papers focused on Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (36 papers) and Advanced Welding Techniques Analysis (17 papers) and collaborates with scholars based in South Korea, Australia and Japan. Bo‐In Noh's co-authors include Seung‐Boo Jung, Jeong‐Won Yoon, Ja‐Myeong Koo, Jong‐Woong Kim and Boyoung Lee and has published in prestigious journals such as Materials Science and Engineering A, Journal of Alloys and Compounds and Japanese Journal of Applied Physics