C. R. Kao

195 papers and 5.1k indexed citations i.

C. R. Kao has authored 195 papers that have received a total of 5.1k indexed citations. This includes 162 papers in Electrical and Electronic Engineering, 93 papers in Mechanical Engineering and 31 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (145 papers), 3D IC and TSV technologies (107 papers) and Intermetallics and Advanced Alloy Properties (43 papers). C. R. Kao is often cited by papers focused on Electronic Packaging and Soldering Technologies (145 papers), 3D IC and TSV technologies (107 papers) and Intermetallics and Advanced Alloy Properties (43 papers) and collaborates with scholars based in Taiwan, United States and Japan. C. R. Kao's co-authors include Cheng–En Ho, Yi-Wun Wang, Y. L. Lin, Tsung‐Lin Yang and Y. A. Chang and has published in prestigious journals such as The Journal of Chemical Physics, Applied Physics Letters and Journal of Applied Physics