Cheng–En Ho
About
Cheng–En Ho has authored 104 papers that have received a total of 2.6k indexed citations.
This includes 89 papers in Electrical and Electronic Engineering, 42 papers in Mechanical Engineering and 34 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (77 papers), 3D IC and TSV technologies (56 papers) and Copper Interconnects and Reliability (34 papers). Cheng–En Ho is often cited by papers focused on Electronic Packaging and Soldering Technologies (77 papers), 3D IC and TSV technologies (56 papers) and Copper Interconnects and Reliability (34 papers) and collaborates with scholars based in Taiwan, United States and China. Cheng–En Ho's co-authors include C. R. Kao, Pei-Tzu Lee, Cheng‐Hsien Yang and Cheng‐Yu Lee and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Chemistry of Materials
In The Last Decade
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