Pei-Tzu Lee
About
Pei-Tzu Lee has authored 36 papers that have received a total of 425 indexed citations.
This includes 21 papers in Electrical and Electronic Engineering, 13 papers in Immunology and 10 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (17 papers), Immune Cell Function and Interaction (13 papers) and 3D IC and TSV technologies (11 papers). Pei-Tzu Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (17 papers), Immune Cell Function and Interaction (13 papers) and 3D IC and TSV technologies (11 papers) and collaborates with scholars based in Taiwan, United States and United Kingdom. Pei-Tzu Lee's co-authors include Cheng–En Ho, Ming‐Ling Kuo, Syh‐Jae Lin, Ji-Yih Chen and Yufang Huang and has published in prestigious journals such as PLoS ONE, Journal of The Electrochemical Society and Scientific Reports
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