C.C. Lee
About
C.C. Lee has authored 23 papers that have received a total of 614 indexed citations.
This includes 20 papers in Electrical and Electronic Engineering, 6 papers in Atomic and Molecular Physics, and Optics and 5 papers in Condensed Matter Physics. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (9 papers) and GaN-based semiconductor devices and materials (5 papers). C.C. Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (9 papers) and GaN-based semiconductor devices and materials (5 papers) and collaborates with scholars based in United States, Taiwan and South Korea. C.C. Lee's co-authors include G. Matijasevic, Ricky W. Chuang, Jungjae Park, W.W. So and Daewon Kim and has published in prestigious journals such as IEEE Transactions on Electron Devices, Journal of Lightwave Technology and IEEE Electron Device Letters
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