G. Matijasevic

14 papers and 386 indexed citations i.

G. Matijasevic has authored 14 papers that have received a total of 386 indexed citations. This includes 13 papers in Electrical and Electronic Engineering, 4 papers in Biomedical Engineering and 4 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (8 papers) and Adhesion, Friction, and Surface Interactions (3 papers). G. Matijasevic is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (8 papers) and Adhesion, Friction, and Surface Interactions (3 papers) and collaborates with scholars based in United States. G. Matijasevic's co-authors include Chin C. Lee, C.C. Lee, Xin Cheng, Catherine Shearer and Lutz Brandt and has published in prestigious journals such as Thin Solid Films, Journal of Electronic Materials and Journal of Electronic Packaging