C.-C. Yang
About
C.-C. Yang has authored 28 papers that have received a total of 382 indexed citations.
This includes 26 papers in Electrical and Electronic Engineering, 25 papers in Electronic, Optical and Magnetic Materials and 4 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Copper Interconnects and Reliability (25 papers), Semiconductor materials and devices (23 papers) and Electronic Packaging and Soldering Technologies (15 papers). C.-C. Yang is often cited by papers focused on Copper Interconnects and Reliability (25 papers), Semiconductor materials and devices (23 papers) and Electronic Packaging and Soldering Technologies (15 papers) and collaborates with scholars based in United States, Taiwan and Switzerland. C.-C. Yang's co-authors include D. Edelstein, R. Rosenberg, P. Flaitz, Griselda Bonilla and Nicholas A. Lanzillo and has published in prestigious journals such as Applied Physics Letters, Macromolecules and Scripta Materialia
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