Chang-Chae Shur
About
Chang-Chae Shur has authored 12 papers that have received a total of 422 indexed citations.
This includes 8 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 3 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Advanced Welding Techniques Analysis (5 papers) and 3D IC and TSV technologies (5 papers). Chang-Chae Shur is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Advanced Welding Techniques Analysis (5 papers) and 3D IC and TSV technologies (5 papers) and collaborates with scholars based in South Korea and Japan. Chang-Chae Shur's co-authors include Seung‐Boo Jung, Chang‐Bae Lee, Jeong‐Won Yoon, Young-Eui Shin and Yun-Mo Yeon and has published in prestigious journals such as Journal of Materials Science, Journal of Alloys and Compounds and Microelectronic Engineering
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