Chang-Chi Lee
About
Chang-Chi Lee has authored 15 papers that have received a total of 144 indexed citations.
This includes 13 papers in Electrical and Electronic Engineering, 3 papers in Materials Chemistry and 3 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (8 papers) and Silicon Carbide Semiconductor Technologies (4 papers). Chang-Chi Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (8 papers) and Silicon Carbide Semiconductor Technologies (4 papers) and collaborates with scholars based in Taiwan and United States. Chang-Chi Lee's co-authors include Tong Hong Wang, Yi‐Shao Lai, Yongxin Lin, Hung-Hsiang Cheng and Meng-Kai Shih and has published in prestigious journals such as IEEE Access, IEEE Transactions on Circuits and Systems I Regular Papers and Microelectronic Engineering
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