Chang‐Woo Lee
About
Chang‐Woo Lee has authored 280 papers that have received a total of 2.8k indexed citations.
This includes 133 papers in Electrical and Electronic Engineering, 79 papers in Mechanical Engineering and 52 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (62 papers), 3D IC and TSV technologies (42 papers) and Vibration and Dynamic Analysis (29 papers). Chang‐Woo Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (62 papers), 3D IC and TSV technologies (42 papers) and Vibration and Dynamic Analysis (29 papers) and collaborates with scholars based in South Korea, United States and China. Chang‐Woo Lee's co-authors include Kee‐Hyun Shin, Jongsu Lee, Yong-Ho Ko, Hyunkyoo Kang and Junghwan Bang and has published in prestigious journals such as ACS Nano, Applied Physics Letters and Journal of Applied Physics
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