Yong-Ho Ko
About
Yong-Ho Ko has authored 48 papers that have received a total of 559 indexed citations.
This includes 46 papers in Electrical and Electronic Engineering, 28 papers in Mechanical Engineering and 4 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (42 papers), 3D IC and TSV technologies (37 papers) and Advanced Welding Techniques Analysis (15 papers). Yong-Ho Ko is often cited by papers focused on Electronic Packaging and Soldering Technologies (42 papers), 3D IC and TSV technologies (37 papers) and Advanced Welding Techniques Analysis (15 papers) and collaborates with scholars based in South Korea, China and Japan. Yong-Ho Ko's co-authors include Chang‐Woo Lee, Junghwan Bang, Taek‐Soo Kim and Mingyu Li and has published in prestigious journals such as ACS Applied Materials & Interfaces, Journal of Materials Chemistry A and Journal of Alloys and Compounds
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