Chao-Pin Yeh
About
Chao-Pin Yeh has authored 12 papers that have received a total of 102 indexed citations.
This includes 7 papers in Electrical and Electronic Engineering, 6 papers in Mechanics of Materials and 3 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), Composite Material Mechanics (2 papers) and 3D IC and TSV technologies (2 papers). Chao-Pin Yeh is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), Composite Material Mechanics (2 papers) and 3D IC and TSV technologies (2 papers) and collaborates with scholars based in United States, China and Taiwan. Chao-Pin Yeh's co-authors include K. Wyatt, Robert E. Fulton, Kai Hu, Yonggang Huang and Qiang Gao and has published in prestigious journals such as IEEE Transactions on Components and Packaging Technologies, Journal of Electronic Packaging and Journal of Tissue Viability
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