Chenxi Wang
About
Chenxi Wang has authored 309 papers that have received a total of 6.0k indexed citations.
This includes 152 papers in Electrical and Electronic Engineering, 83 papers in Biomedical Engineering and 70 papers in Materials Chemistry. The topics of these papers are 3D IC and TSV technologies (40 papers), Electronic Packaging and Soldering Technologies (26 papers) and Electrochemical sensors and biosensors (23 papers). Chenxi Wang is often cited by papers focused on 3D IC and TSV technologies (40 papers), Electronic Packaging and Soldering Technologies (26 papers) and Electrochemical sensors and biosensors (23 papers) and collaborates with scholars based in China, Japan and United States. Chenxi Wang's co-authors include Yanhong Tian, Tadatomo Suga, Yixi Xie, Pengcheng Zhao and Junjie Fei and has published in prestigious journals such as Angewandte Chemie International Edition, Advanced Materials and Nature Communications
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