Tadatomo Suga
About
Tadatomo Suga has authored 369 papers that have received a total of 6.1k indexed citations.
This includes 264 papers in Electrical and Electronic Engineering, 69 papers in Biomedical Engineering and 66 papers in Materials Chemistry. The topics of these papers are 3D IC and TSV technologies (172 papers), Electronic Packaging and Soldering Technologies (116 papers) and Semiconductor materials and devices (52 papers). Tadatomo Suga is often cited by papers focused on 3D IC and TSV technologies (172 papers), Electronic Packaging and Soldering Technologies (116 papers) and Semiconductor materials and devices (52 papers) and collaborates with scholars based in Japan, China and United States. Tadatomo Suga's co-authors include Toshihiro Itoh, Fengwen Mu, Eiji Higurashi, Chenxi Wang and Masahisa Fujino and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society
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