Masahisa Fujino
About
Masahisa Fujino has authored 70 papers that have received a total of 1.6k indexed citations.
This includes 50 papers in Electrical and Electronic Engineering, 27 papers in Biomedical Engineering and 15 papers in Mechanical Engineering. The topics of these papers are 3D IC and TSV technologies (32 papers), Electronic Packaging and Soldering Technologies (17 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (13 papers). Masahisa Fujino is often cited by papers focused on 3D IC and TSV technologies (32 papers), Electronic Packaging and Soldering Technologies (17 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (13 papers) and collaborates with scholars based in Japan, Taiwan and France. Masahisa Fujino's co-authors include Tadatomo Suga, T. Masuzawa, Fengwen Mu, Ran He and Yoshikazu Takahashi and has published in prestigious journals such as Journal of Applied Physics, Neurology and Applied Surface Science
In The Last Decade
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