Chia-Ling Lu

8 papers and 432 indexed citations i.

Chia-Ling Lu has authored 8 papers that have received a total of 432 indexed citations. This includes 6 papers in Electrical and Electronic Engineering, 4 papers in Electronic, Optical and Magnetic Materials and 3 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (4 papers) and Copper Interconnects and Reliability (4 papers). Chia-Ling Lu is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (4 papers) and Copper Interconnects and Reliability (4 papers) and collaborates with scholars based in Taiwan and United States. Chia-Ling Lu's co-authors include Chih Chen, Han-wen Lin, Chien-Min Liu, K. N. Tu and Yi-Sa Huang and has published in prestigious journals such as Science, Journal of The Electrochemical Society and Acta Materialia