Yi-Sa Huang
About
Yi-Sa Huang has authored 8 papers that have received a total of 617 indexed citations.
This includes 7 papers in Electrical and Electronic Engineering, 5 papers in Electronic, Optical and Magnetic Materials and 2 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), Copper Interconnects and Reliability (5 papers) and Surface and Thin Film Phenomena (2 papers). Yi-Sa Huang is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), Copper Interconnects and Reliability (5 papers) and Surface and Thin Film Phenomena (2 papers) and collaborates with scholars based in Taiwan and United States. Yi-Sa Huang's co-authors include Chih Chen, Chien-Min Liu, K. N. Tu, Han-wen Lin and Hsiang‐Yao Hsiao and has published in prestigious journals such as Science, Scientific Reports and Scripta Materialia
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by Willow A. Sheremata are published in Top fields papers by Alison Pattie are about Top fields papers by Patrick G.N. Romano are about Top authors papers by Wiebke Fenske are co-authored with Top journals papers by Paul Fairlie are published in Top countries impacted by papers by Paul E. Pearce Top authors papers by Francis Mueller are co-authored with Top fields papers by Maartje J. A. Geirnaerdt are about