Hsiang‐Yao Hsiao
About
Hsiang‐Yao Hsiao has authored 10 papers that have received a total of 677 indexed citations.
This includes 10 papers in Electrical and Electronic Engineering, 7 papers in Electronic, Optical and Magnetic Materials and 2 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (7 papers) and Copper Interconnects and Reliability (7 papers). Hsiang‐Yao Hsiao is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (7 papers) and Copper Interconnects and Reliability (7 papers) and collaborates with scholars based in Taiwan, United States and Singapore. Hsiang‐Yao Hsiao's co-authors include Chih Chen, Yi-Sa Huang, Chien-Min Liu, Han-wen Lin and Chia-Ling Lu and has published in prestigious journals such as Science, Applied Physics Letters and Journal of Applied Physics
In The Last Decade
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