Chia-Wei Huang
About
Chia-Wei Huang has authored 19 papers that have received a total of 486 indexed citations.
This includes 10 papers in Materials Chemistry, 10 papers in Atomic and Molecular Physics, and Optics and 7 papers in Mechanical Engineering. The topics of these papers are Graphene research and applications (7 papers), Electronic Packaging and Soldering Technologies (6 papers) and Quantum and electron transport phenomena (6 papers). Chia-Wei Huang is often cited by papers focused on Graphene research and applications (7 papers), Electronic Packaging and Soldering Technologies (6 papers) and Quantum and electron transport phenomena (6 papers) and collaborates with scholars based in Taiwan, Israel and Germany. Chia-Wei Huang's co-authors include Kwang‐Lung Lin, Efrat Shimshoni, L.C. Tsao, Sam T. Carr and H. A. Fertig and has published in prestigious journals such as Physical Review B, Materials Science and Engineering A and Journal of materials research/Pratt's guide to venture capital sources
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