Chin C. Lee

67 papers and 891 indexed citations i.

Chin C. Lee has authored 67 papers that have received a total of 891 indexed citations. This includes 59 papers in Electrical and Electronic Engineering, 26 papers in Mechanical Engineering and 12 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (37 papers) and Advanced Welding Techniques Analysis (11 papers). Chin C. Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (48 papers), 3D IC and TSV technologies (37 papers) and Advanced Welding Techniques Analysis (11 papers) and collaborates with scholars based in United States, China and Taiwan. Chin C. Lee's co-authors include Jong Seung Kim, G. Matijasevic, Ricky W. Chuang, Jeong Park and Jongsung Kim and has published in prestigious journals such as Journal of The Electrochemical Society, Electrochimica Acta and Optics Letters