Christian Dresbach
About
Christian Dresbach has authored 14 papers that have received a total of 467 indexed citations.
This includes 8 papers in Mechanics of Materials, 6 papers in Electrical and Electronic Engineering and 6 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (4 papers) and Probabilistic and Robust Engineering Design (3 papers). Christian Dresbach is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (4 papers) and Probabilistic and Robust Engineering Design (3 papers) and collaborates with scholars based in Germany, Slovakia and France. Christian Dresbach's co-authors include Matthias Petzold, Thomas Becker, Mato Knez, J. Bagdahn and Seung‐Mo Lee and has published in prestigious journals such as Science, Physical Chemistry Chemical Physics and Applied Materials Today
In The Last Decade
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