Chunhua Hu
About
Chunhua Hu has authored 28 papers that have received a total of 670 indexed citations.
This includes 25 papers in Electrical and Electronic Engineering, 25 papers in Electronic, Optical and Magnetic Materials and 7 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Copper Interconnects and Reliability (24 papers), Electronic Packaging and Soldering Technologies (20 papers) and Semiconductor materials and devices (11 papers). Chunhua Hu is often cited by papers focused on Copper Interconnects and Reliability (24 papers), Electronic Packaging and Soldering Technologies (20 papers) and Semiconductor materials and devices (11 papers) and collaborates with scholars based in United States, China and Switzerland. Chunhua Hu's co-authors include T. Nogami, H. Shobha, Lynne Gignac, R. Rosenberg and A. Simon and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society
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