H. Shobha

28 papers and 194 indexed citations i.

H. Shobha has authored 28 papers that have received a total of 194 indexed citations. This includes 28 papers in Electrical and Electronic Engineering, 25 papers in Electronic, Optical and Magnetic Materials and 5 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (25 papers), Semiconductor materials and devices (21 papers) and Electronic Packaging and Soldering Technologies (9 papers). H. Shobha is often cited by papers focused on Copper Interconnects and Reliability (25 papers), Semiconductor materials and devices (21 papers) and Electronic Packaging and Soldering Technologies (9 papers) and collaborates with scholars based in United States, Germany and Switzerland. H. Shobha's co-authors include T. Spooner, A. Grill, S. Nguyen, Chunhua Hu and T. Nogami and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society