Chunqing Wang
About
Chunqing Wang has authored 202 papers that have received a total of 3.0k indexed citations.
This includes 144 papers in Electrical and Electronic Engineering, 92 papers in Mechanical Engineering and 39 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (114 papers), 3D IC and TSV technologies (65 papers) and Advanced Welding Techniques Analysis (37 papers). Chunqing Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (114 papers), 3D IC and TSV technologies (65 papers) and Advanced Welding Techniques Analysis (37 papers) and collaborates with scholars based in China, United States and South Korea. Chunqing Wang's co-authors include Yanhong Tian, Mingyu Li, Rong An, Hongjun Ji and Hongtao Chen and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Journal of Power Sources
In The Last Decade
Explore authors with similar magnitude of impact
Top countries impacted by papers by Makoto Ueno Top fields papers by Stefanie Joos are about Top countries impacted by papers by Alexander I. Archakov Top authors papers by Vladimír Palička are co-authored with Top fields papers by Hye‐Kyung Park are about Top authors papers by Jacob Bornstein are co-authored with Top journals papers by Kenjiro Yasuda are published in Top fields papers by Xiaowu Li are about