Hongtao Chen
About
Hongtao Chen has authored 51 papers that have received a total of 805 indexed citations.
This includes 30 papers in Electrical and Electronic Engineering, 29 papers in Mechanical Engineering and 10 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (19 papers) and Aluminum Alloys Composites Properties (10 papers). Hongtao Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (25 papers), 3D IC and TSV technologies (19 papers) and Aluminum Alloys Composites Properties (10 papers) and collaborates with scholars based in China, Australia and United States. Hongtao Chen's co-authors include Mingyu Li, Chunqing Wang, Chunjin Hang, Zhihao Zhang and Jing Han and has published in prestigious journals such as Acta Materialia, Scientific Reports and The Journal of Physical Chemistry C
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