Jing Han

60 papers and 1.1k indexed citations i.

Jing Han has authored 60 papers that have received a total of 1.1k indexed citations. This includes 39 papers in Electrical and Electronic Engineering, 24 papers in Mechanical Engineering and 9 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (36 papers), 3D IC and TSV technologies (16 papers) and Advanced Welding Techniques Analysis (12 papers). Jing Han is often cited by papers focused on Electronic Packaging and Soldering Technologies (36 papers), 3D IC and TSV technologies (16 papers) and Advanced Welding Techniques Analysis (12 papers) and collaborates with scholars based in China, United States and Australia. Jing Han's co-authors include Fu Guo, Fu Guo, Jun Nie, Yishu Wang and Mingyu Li and has published in prestigious journals such as Journal of Materials Science, Industrial & Engineering Chemistry Research and Journal of Pharmaceutical Sciences