Fu Guo
About
Fu Guo has authored 107 papers that have received a total of 3.7k indexed citations.
This includes 68 papers in Electrical and Electronic Engineering, 54 papers in Mechanical Engineering and 24 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (62 papers), 3D IC and TSV technologies (39 papers) and Aluminum Alloys Composites Properties (22 papers). Fu Guo is often cited by papers focused on Electronic Packaging and Soldering Technologies (62 papers), 3D IC and TSV technologies (39 papers) and Aluminum Alloys Composites Properties (22 papers) and collaborates with scholars based in China, United States and Canada. Fu Guo's co-authors include Yao Shi, Guangchen Xu, Yongping Lei, Zhidong Xia and Yishu Wang and has published in prestigious journals such as Nature, Science and Journal of the American Chemical Society
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