Guangchen Xu
About
Guangchen Xu has authored 20 papers that have received a total of 340 indexed citations.
This includes 20 papers in Electrical and Electronic Engineering, 13 papers in Electronic, Optical and Magnetic Materials and 7 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (16 papers) and Copper Interconnects and Reliability (13 papers). Guangchen Xu is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (16 papers) and Copper Interconnects and Reliability (13 papers) and collaborates with scholars based in China, United States and Yemen. Guangchen Xu's co-authors include Fu Guo, Fu Guo, Xitao Wang, Yao Shi and Yongping Lei and has published in prestigious journals such as Journal of Materials Science, Journal of Alloys and Compounds and Journal of Material Science and Technology
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