Chunjin Hang
About
Chunjin Hang has authored 53 papers that have received a total of 746 indexed citations.
This includes 43 papers in Electrical and Electronic Engineering, 31 papers in Mechanical Engineering and 7 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (19 papers) and Aluminum Alloys Composites Properties (18 papers). Chunjin Hang is often cited by papers focused on Electronic Packaging and Soldering Technologies (30 papers), 3D IC and TSV technologies (19 papers) and Aluminum Alloys Composites Properties (18 papers) and collaborates with scholars based in China, South Korea and Hong Kong. Chunjin Hang's co-authors include Yanhong Tian, Mingyu Li, Chunqing Wang, Hongtao Chen and Hongtao Chen and has published in prestigious journals such as Scientific Reports, Chemical Engineering Journal and Materials Science and Engineering A
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