Chunyan Yin
About
Chunyan Yin has authored 45 papers that have received a total of 579 indexed citations.
This includes 21 papers in Electrical and Electronic Engineering, 7 papers in Mechanics of Materials and 5 papers in Safety, Risk, Reliability and Quality. The topics of these papers are Electronic Packaging and Soldering Technologies (15 papers), Silicon Carbide Semiconductor Technologies (9 papers) and 3D IC and TSV technologies (7 papers). Chunyan Yin is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), Silicon Carbide Semiconductor Technologies (9 papers) and 3D IC and TSV technologies (7 papers) and collaborates with scholars based in United Kingdom, China and Hong Kong. Chunyan Yin's co-authors include C. Bailey, Hua Lu, C. Mark Johnson, Mahera Musallam and Fang Zhong and has published in prestigious journals such as Advanced Materials, IEEE Transactions on Power Electronics and IEEE Access
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