C.J. Hang

8 papers and 240 indexed citations i.

C.J. Hang has authored 8 papers that have received a total of 240 indexed citations. This includes 7 papers in Electrical and Electronic Engineering, 3 papers in Mechanical Engineering and 2 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (4 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers). C.J. Hang is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (4 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers) and collaborates with scholars based in China, Canada and Japan. C.J. Hang's co-authors include Y. Zhou, M. Mayer, Chunqing Wang, I. Lum and John Persic and has published in prestigious journals such as Advanced Materials, Journal of Electronic Materials and Microelectronic Engineering