D. D. Brown
About
D. D. Brown has authored 26 papers that have received a total of 351 indexed citations.
This includes 20 papers in Electrical and Electronic Engineering, 19 papers in Electronic, Optical and Magnetic Materials and 6 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (19 papers), Electronic Packaging and Soldering Technologies (16 papers) and Semiconductor materials and devices (11 papers). D. D. Brown is often cited by papers focused on Copper Interconnects and Reliability (19 papers), Electronic Packaging and Soldering Technologies (16 papers) and Semiconductor materials and devices (11 papers) and collaborates with scholars based in United States, Canada and Australia. D. D. Brown's co-authors include M. A. Korhonen, C.-Y. Li, Peter Børgesen, Che‐Yu Li and John E. Sanchez and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Cement and Concrete Research
In The Last Decade
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