M. A. Korhonen
About
M. A. Korhonen has authored 75 papers that have received a total of 1.5k indexed citations.
This includes 46 papers in Electrical and Electronic Engineering, 35 papers in Electronic, Optical and Magnetic Materials and 28 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (38 papers), Copper Interconnects and Reliability (34 papers) and Metal and Thin Film Mechanics (14 papers). M. A. Korhonen is often cited by papers focused on Electronic Packaging and Soldering Technologies (38 papers), Copper Interconnects and Reliability (34 papers) and Metal and Thin Film Mechanics (14 papers) and collaborates with scholars based in United States, Australia and Germany. M. A. Korhonen's co-authors include C.-Y. Li, Che‐Yu Li, D. D. Brown, Peter Børgesen and Tia‐Marje Korhonen and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Materials Science and Engineering A
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