Tia‐Marje Korhonen
About
Tia‐Marje Korhonen has authored 19 papers that have received a total of 358 indexed citations.
This includes 16 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 5 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), Advanced Welding Techniques Analysis (6 papers) and 3D IC and TSV technologies (6 papers). Tia‐Marje Korhonen is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Advanced Welding Techniques Analysis (6 papers) and 3D IC and TSV technologies (6 papers) and collaborates with scholars based in United States, Finland and The Netherlands. Tia‐Marje Korhonen's co-authors include M. A. Korhonen, Brian Corbett, Peng Su, C.-Y. Li and Mikko Karppinen and has published in prestigious journals such as International Journal of Cancer, Optics Express and AJP Cell Physiology
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