D. Grivas
About
D. Grivas has authored 13 papers that have received a total of 491 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 4 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (7 papers) and Advanced Welding Techniques Analysis (6 papers). D. Grivas is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (7 papers) and Advanced Welding Techniques Analysis (6 papers) and collaborates with scholars based in United States and Germany. D. Grivas's co-authors include J. W. Morris, D. R. Frear, Z. Mei, J.W. Morris and Terence G. Langdon and has published in prestigious journals such as JOM, Journal of Electronic Materials and Journal of Electronic Packaging
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