Dae‐Gon Kim
About
Dae‐Gon Kim has authored 54 papers that have received a total of 1.1k indexed citations.
This includes 43 papers in Electrical and Electronic Engineering, 24 papers in Mechanical Engineering and 15 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (22 papers) and Advanced Welding Techniques Analysis (9 papers). Dae‐Gon Kim is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (22 papers) and Advanced Welding Techniques Analysis (9 papers) and collaborates with scholars based in South Korea, United States and Australia. Dae‐Gon Kim's co-authors include Seung‐Boo Jung, Jong‐Woong Kim, Jeong‐Won Yoon, Ja‐Myeong Koo and Hansuek Lee and has published in prestigious journals such as Nature Communications, Small and Optics Letters
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