Daniel I. Amey
About
Daniel I. Amey has authored 8 papers that have received a total of 52 indexed citations.
This includes 7 papers in Electrical and Electronic Engineering, 1 paper in Materials Chemistry and 1 paper in Computational Mechanics. The topics of these papers are 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (3 papers) and Electromagnetic Compatibility and Noise Suppression (2 papers). Daniel I. Amey is often cited by papers focused on 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (3 papers) and Electromagnetic Compatibility and Noise Suppression (2 papers) and collaborates with scholars based in United States. Daniel I. Amey's co-authors include Madhavan Swaminathan, A. Ege Engin, Rao Tummala, Lap‐Tak Cheng and R.J. Bouchard and has published in prestigious journals such as Journal of materials research/Pratt's guide to venture capital sources, Computer and IEEE Transactions on Advanced Packaging
In The Last Decade
Explore authors with similar magnitude of impact
Top fields papers by Tull T. Glazener are about Top journals papers by Tian Pan are published in Top journals papers by Anamaria Verdugo are published in Top fields papers by Anders Korsbäck are about Top fields papers by Angélique Chapelle are about Top journals papers by Maria Vayanou are published in Top journals papers by M. Tosi are published in Top authors papers by Y. Feng are co-authored with