Rao Tummala
About
Rao Tummala has authored 224 papers that have received a total of 5.4k indexed citations.
This includes 176 papers in Electrical and Electronic Engineering, 62 papers in Biomedical Engineering and 43 papers in Materials Chemistry. The topics of these papers are 3D IC and TSV technologies (109 papers), Electronic Packaging and Soldering Technologies (76 papers) and Electromagnetic Compatibility and Noise Suppression (30 papers). Rao Tummala is often cited by papers focused on 3D IC and TSV technologies (109 papers), Electronic Packaging and Soldering Technologies (76 papers) and Electromagnetic Compatibility and Noise Suppression (30 papers) and collaborates with scholars based in United States, Japan and South Korea. Rao Tummala's co-authors include Venky Sundaram, P. Markondeya Raj, Madhavan Swaminathan, Atom O. Watanabe and Vanessa Smet and has published in prestigious journals such as Nano Letters, Applied Physics Letters and Journal of Applied Physics
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