Venky Sundaram

56 papers and 566 indexed citations i.

Venky Sundaram has authored 56 papers that have received a total of 566 indexed citations. This includes 54 papers in Electrical and Electronic Engineering, 16 papers in Biomedical Engineering and 5 papers in Automotive Engineering. The topics of these papers are 3D IC and TSV technologies (38 papers), Electronic Packaging and Soldering Technologies (27 papers) and Electromagnetic Compatibility and Noise Suppression (12 papers). Venky Sundaram is often cited by papers focused on 3D IC and TSV technologies (38 papers), Electronic Packaging and Soldering Technologies (27 papers) and Electromagnetic Compatibility and Noise Suppression (12 papers) and collaborates with scholars based in United States, South Korea and Japan. Venky Sundaram's co-authors include Rao Tummala, P. Markondeya Raj, Joungho Kim, S.K. Sitaraman and Vanessa Smet and has published in prestigious journals such as Journal of Electronic Materials, Journal of Materials Science Materials in Electronics and IEEE Transactions on Electromagnetic Compatibility