Daniel I. Amey

8 papers and 52 indexed citations i.

Daniel I. Amey has authored 8 papers that have received a total of 52 indexed citations. This includes 7 papers in Electrical and Electronic Engineering, 1 paper in Materials Chemistry and 1 paper in Computational Mechanics. The topics of these papers are 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (3 papers) and Electromagnetic Compatibility and Noise Suppression (2 papers). Daniel I. Amey is often cited by papers focused on 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (3 papers) and Electromagnetic Compatibility and Noise Suppression (2 papers) and collaborates with scholars based in United States. Daniel I. Amey's co-authors include Madhavan Swaminathan, A. Ege Engin, Rao Tummala, Lap‐Tak Cheng and R.J. Bouchard and has published in prestigious journals such as Journal of materials research/Pratt's guide to venture capital sources, Computer and IEEE Transactions on Advanced Packaging