David A. Hutt
About
David A. Hutt has authored 74 papers that have received a total of 1.2k indexed citations.
This includes 61 papers in Electrical and Electronic Engineering, 20 papers in Biomedical Engineering and 12 papers in Computational Mechanics. The topics of these papers are Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (17 papers) and Molecular Junctions and Nanostructures (17 papers). David A. Hutt is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (17 papers) and Molecular Junctions and Nanostructures (17 papers) and collaborates with scholars based in United Kingdom, Canada and China. David A. Hutt's co-authors include Paul Conway, Graham J. Leggett, D.C. Whalley, S.H. Mannan and David R. Selviah and has published in prestigious journals such as Applied Physics Letters, The Journal of Physical Chemistry B and Langmuir
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